Unsoldering 脫焊

TSOP-48 packedge
TSOP-48封裝

Use hot air:
使用熱風(fēng)槍

Temperature 370 把
溫度370度
Unsolder each side separetly

Clean chip fron flux and rest of solder
從焊劑和焊料的其余部分清除芯片
If move finger from bottom of chip pins – they must be smooth
如果從芯片底部移動(dòng) – 它們必須平滑

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